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Your Trusted Partner for High-End Electronics
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| Standard Multilayer PCB | |
| Item | Processing Capability |
| Max Layer Count | 50 |
| Board Thickness Range | 0.20 mm -- 5.6 mm |
| Min Outer Trace Width/Spacing | 3.0 / 3.0 mil |
| Max Outer Copper Thickness | 30 OZ |
| Max Inner Copper Thickness | 15 OZ |
| Max Aspect Ratio | 20:1 |
| Board Thickness Tolerance | t≥0.8mm, ±10%; t<0.8mm, ±0.08mm |
| Finished Hole Size (Mechanical) | 0.15mm -- 6.50mm |
| Hole Position Tolerance (Mechanical) | ±0.05mm |
| Outer Dimension Tolerance | ±0.05mm (±2 mil) |
| Min Solder Mask Dam | 0.075mm (Green mask) / 0.125mm (Other colors) |
| Impedance Tolerance | < 50Ω±5Ω, ≥50Ω±10% |
| Surface Finish | HASL (Lead/Lead-Free), ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP, Hard Gold Fingers, Carbon Ink, Blue Peelable Mask, Selective Finish, etc. |
| Special Processes | POFV, Blind/Buried Vias, Backdrill, Stepped Cavity, Mixed Pressing, Countersink, Copper Paste Plugging, etc. |
| High Layer Count PCB | ||
| Product | Structure/Parameter | |
| High Multilayer Board | Min Trace Width | 3.0/3.0 (S) |
| High Multilayer Board | Trace Width Tolerance | ±0.8mil |
| High Multilayer Board | Max Layer Count | 50 (S) |
| High Multilayer Board | Aspect Ratio | 20:1(4.0/0.25) (S) |
| Thick Copper | Max Inner Copper Thickness | 30 OZ |
| Thick Copper | Max Inner Copper Thickness | 15 OZ |
| Blind & Buried Vias | HDI Stages (Press Cycles) | 3 (S) |
| Blind & Buried Vias | Resin Plugging Dimple (um) | ≤75 |
| HDI(S) | Blind Via Aspect Ratio | 0.8: 1 |
| HDI(S) | Filled Via Aspect Ratio | 0.8: 1 |
| HDI(S) | HDI Stages | 5 |
| Rigid-Flex (S) | Flex Layer Count | 12 |
| Rigid-Flex (S) | Structure | Book-binder, Air-gap, Flying tail |
| Prototype PCB | ||
| Category | Item | Capability |
| Basic Services | MOQ | 5 pcs (Pieces) |
| Fastest Lead Time | 12 Hours / 24 Hours (For 1-4 Layers) | |
| Standard Lead Time | 2-4 Days | |
| E-Test | 100% Flying Probe Test | |
| Board Spec | Layer Count | 1 - 14 Layers (Quick-turn focus) |
| Base Material | FR-4 (Tg130-140, Tg150-160), Halogen-free | |
| Board Thickness | 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0 mm | |
| Max Dimension | 400mm × 500mm | |
| Copper & Routing | Finished Copper | 1 oz, 2 oz |
| Min Trace / Space | 4/4 mil (0.1/0.1mm) for Multi-layer、5/5 mil for 1-2 Layers | |
| Impedance Control | Yes (Tolerance: ±10%) | |
| Drilling & Vias | Min Hole Size | 0.15 mm (Via) / 0.20 mm (Component Hole) |
| Via Process | Tenting, Plugged, Untented/Exposed | |
| Castellated Holes | Supported (Min hole diameter: 0.6mm) | |
| Solder Mask & Silk | Solder Mask Color | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte Green |
| Silkscreen Color | White, Black, Yellow | |
| Finishes & Edges | Surface Finish | HASL, HASL Lead-Free, ENIG (Immersion Gold) |
| Gold Fingers | Supported (Hard Gold up to 30 U") | |
| Panel Options | Single board, V-scoring, Tab Routing (Mouse Bites) | |
| Outline Tolerance | CNC Routing: ±0.2mm / V-scoring: ±0.4mm | |
| Mass Production PCB | |
| Feature | Capability |
| Layer Capability | 1-50 layers |
| Quality Control | AOI, E-test, impedance test |
| Production | Stable volume manufacturing |
| Applications | Industrial, automotive, communication |
| HDI PCB | ||
| Item | Prototype | Mass Production |
| Structure | 6-Stage | 3-Stage |
| Laser Via Size (mm) | 0.075 | 0.1-0.15 |
| Max Laser Via Depth/Hole Aspect Ratio | 1:1 | 0.8:1 |
| Laser Via Plating Depth/Hole Aspect Ratio | 0.8:1 | 0.8:1 |
| Laser Via Annular Ring (mil) | 4 | 5 |
| Laser Via Bottom Pad Dia. (mil) | D(Laser via dia.)+6 | D(Laser via dia.)+8 |
| Laser Drilling Material | FR4, PTFE, Hydrocarbon, etc. | FR4, PTFE, Hydrocarbon, etc. |
| Laser Layer Dielectric | 106H、106*2、1080*1、1080H （0.06mm-0.09mm) | 106H、106*2、1080*1、1080H （0.06mm-0.09mm) |
| High Speed High Frequency PCB | ||
| Type | Model | Supplier |
| High Frequency | S7136 | Guangdong Shengyi |
| High Frequency | RO3003、RO3010、RO4003、RO4350、RO5880、RO6002、RO6010 | Rogers |
| High Frequency | RF35、TLY-5、TLX-7、TLX-8、TLX-9 | Taconic |
| High Frequency | AD255 | Arlon |
| High Speed | TU872、TU883、TU933+ | TUC |
| High Speed | M4、M6、M7 | Panasonic |
| RF Microwave PCB | |
| Item | Processing Capability |
| Process | Mixed press, 6-16 layers, 1 or 2-stage HDI |
| Min Outer Trace Width/Spacing | 3.0/3.0 mil |
| Laser Via Size | 0.075-0.15mm |
| Laser Blind Via Aspect Ratio | 0.8:1 |
| Antenna Precision | ±15um (Copper thickness HOZ) |
| Antenna Perpendicularity (Burr) | ≤10um |
| Oscillator Square Pad Orthogonality | EA Value ≤10um |
| Material | Rogers3003/3003G2/3003RA、SY mmWave 77、Panasonic 5515、ISOLA MT77、AGC NF-30 |
| Application Fields | ADAS, Smart Parking, Smart Toilet, Security Scanner, Anti-intrusion, Life Detection, etc. |
| Thick Copper PCB | ||||
| Base Copper | 6oz | 8oz | 10oz | 12oz |
| Orig Min Trace Width/Spacing(Norm) | 13/11 | 18/16 | 23/21 | 28/26 |
| Orig Min Trace Width/Spacing(Extr) | (8/11.5) | (10/16) | (12/21) | (16/26) |
| Min Spacing After Comp(Extr) | 9(8) | 11(10) | 13(12) | 15(14) |
| Compensation Value (Extr) | 4(3.5) | 7(6) | 10(9) | 13(12) |
| Hole to Copper / Annular Ring to Large Copper | 12 | 14 | 16 | 18 |
| Rigid Flex PCB | ||
| Item | Processing Capability | |
| DuPont | Flex Board | AP-8545R |
| TUC (Taiyo) | Low Flow PP | TU-84PNF 1080 |
| Shengyi | Flex Board | SF202 20 18DR |
| Shengyi | Flex Board | SF202 20 35DR |
| Shengyi | Pure Adhesive | SF315B 25 |
| Shengyi | Coverlay (Yellow) | SF305C 0525 |
| Shengyi | Coverlay (Yellow) | SF305C 1025 |
| Shengyi | Coverlay (Yellow) | SF305C 1035 |
| Flexible PCB | |
| Item | Capability |
| Material | Polyimide Flexible Material |
| Layer | Single, Double and Multilayer Flex |
| Application | Wearable, Medical, Consumer Electronics |
| Processing | Laser drilling and precision routing |
| Metal Core PCB | |
| Item | Capability |
| Material | Aluminum Core / Metal Core |
| Thermal Management | High heat dissipation |
| Application | LED, Power Electronics, Automotive |
| Ceramic Material Capability | ||||
| 1.Ceramic Types & Properties | ||||
| Property | AL₂O₃ | ALN | SIN | Unit |
| Density | 3.7 | 3.3 | 3.2 | g/cm³ |
| Thermal conductivity | ≥23 | ≥170 | ≥90 | W/m·K |
| Thermal expansion | 6.6~7.5 (25~500℃) | 4.7 (20~300℃) | 2.5 (20~300℃) | 10⁻⁶/K |
| Bending Strength | ≥330 | ≥350 | 700~800 | MPa |
| Dielectric Loss | 0.0003 | 0.0005 | 0.001 | 1MHz |
| Dielectric Constant | 9 | 9 | 8 | 1MHz |
| Dielectric Strength | ≥20 | ≥20 | ≥20 | KV/mm |
| Electrical Resistivity | 10¹⁴ | 10¹⁴ | 10¹⁴ | Ω·cm |
| 2.Copper Properties | ||
| Property | Parameter | Unit |
| Purity | ≥99.99 | % |
| O₂ content | OFHC | - |
| Hardness | 80~110 | HV |
| Electrical Conductivity | 98.3 | MS/m |
| 3.General Properties & Tolerances | |
| General Properties | Specification |
| Dimensional Tolerance | +0.2 / -0.05 mm |
| Master Substrate | 138×190mm ±0.1mm / 130×130mm ±0.1mm |
| Copper Edge to Ceramic Edge | ±0.15 mm |
| Total Thickness | ±5% |
| Through-hole Diameter | ±0.1 mm |
| Usable Area (for 130x130mm master) | 127mm × 127mm |
| Usable Area (for 138x190mm master) | 136mm × 187mm |
| Ceramic Material Combination | |||
| 4. Ceramic Thickness vs Material | |||
| Tile Thickness (mm) | AL₂O₃ | AlN | Si₃N₄ |
| 0.16 | ✓ | ✓ | - |
| 0.25 | ✓ | ✓ | ✓ |
| 0.32 | ✓ | ✓ | ✓ |
| 0.38 | ✓ | ✓ | - |
| 0.50 | ✓ | ✓ | - |
| 0.60 | ✓ | ✓ | - |
| 0.63 | ✓ | ✓ | - |
| 0.76 | ✓ | ✓ | - |
| 0.89 | ✓ | ✓ | - |
| 1.0 | ✓ | ✓ | - |
| 1.5 | ✓ | ✓ | ✓ |
| 2.0 | ✓ | ✓ | ✓ |
| 5. Ceramic Types & Thickness | |||||
| Copper Sheet Thickness (mm) | Ceramic Thickness 0.25mm | Ceramic Thickness 0.32mm | Ceramic Thickness 0.38mm | Ceramic Thickness 0.635mm | Ceramic Thickness 1.0mm |
| 0.15 | SIN / Al₂O₃ | SIN / Al₂O₃ | Al₂O₃ | SIN / AlN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| 0.20 | SIN / Al₂O₃ | SIN / Al₂O₃ | Al₂O₃ | SIN / AlN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| 0.25 | SIN / Al₂O₃ | SIN / Al₂O₃ | Al₂O₃ | SIN / AlN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| 0.30 | SIN / Al₂O₃ | SIN / Al₂O₃ | Al₂O₃ | SIN / AlN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| 0.40 | SIN / Al₂O₃ | SIN / Al₂O₃ | - | SIN / AlN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| 0.50 | SIN / Al₂O₃ | SIN / Al₂O₃ | - | SIN / AlN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| 0.80 | SIN / Al₂O₃ | SIN / Al₂O₃ | - | SIN / Al₂O₃ | SIN / AlN / Al₂O₃ |
| Tolerance & Surface Treatment | |
| 6.Dimensional Tolerances | |
| Item | Dimensional Tolerance |
| Master Substrate | 138x190mm ±0.1mm or 130x130mm ±0.1mm |
| Copper Edge to Ceramic Edge | ±0.15mm |
| Total Thickness | ±5% |
| Through-hole Diameter | ±0.1mm |
| 7. Usable Area | |
| Master Size | Usable Area |
| 130mm X 130mm Base Plate | 127mm X 127mm |
| 138mm X 190mm Base Plate | 136mm X 187mm |
| 8. Surface Finish | |
| Surface Finish | Specification |
| Bare Copper | OSP |
| Anti-oxidation | OSP |
| Nickel plating | Ni: 2~10 μm |
| Au plating | Au: 0.1~0.20 μm |
| Ag plating | Ag: 0.3~1.0 μm |
| Sn plating | Sn: 0.1~0.2 mm |
| 9. Corrosion Tolerance | |
| Tolerance A | Thickness T |
| A ± 0.15 mm | T ≤ 0.20 mm |
| A ± 0.20 mm | T ≤ 0.25 mm |
| A ± 0.25 mm | T ≤ 0.40 mm |
| A ± 0.30 mm | T ≤ 0.50 mm |
| A ± 0.35 mm | T ≤ 0.80 mm |
| 10.Solder Resist | |
| Item | Parameter |
| Pattern Width | Min J > 0.3±0.2mm |
| Position Tolerance | ±0.2mm |
| Minimum Space Between Solder Mask Patterns | ≥0.3mm |
| Minimum Distance From Solder Mask Edge To Copper Edge | ≥0mm (Copper Sheet Thickness≤0.3mm) / ≥1mm (Copper Sheet Thickness>0.3mm) |
| Heat Resistance | ≤320℃/10s (Tested in accordance with IPC-TM-650, Method 2.6.8) |
| AMB Ceramic PCB | ||
| 11. AMB Substrate Properties | ||
| Item | Value | Unit |
| Maximum Dimension | 190*138 | mm |
| Line Spacing | ≥0.3 | mm |
| Line Width | As per customer product requirements | mm |
| Copper Peel Strength (Min.) | >40 | N/mm |
| Solderability | >95% | % |
| Delivery Form | Small panel delivery / Large panel delivery | - |
| Surface Condition | Bare copper / Solder mask / ENIG / Silver plating | μm |
| 12. Copper Pattern Spacing Dimension | ||
| Copper Thickness (mm) | Minimum Spacing (mm) | Minimum Pitch (mm) |
| 0.20 | 0.35 | 0.7 |
| 0.25 | 0.40 | 0.8 |
| 0.30 | 0.50 | 1.0 |
| 0.40 | 0.60 | 1.2 |
| 0.50 | 0.70 | 1.4 |
| 0.80 | 1.00 | 2.0 |
| 13.Copper Edge to Ceramic Edge | |
| Copper Thickness(mm) | Copper Edge to Ceramic Edge |
| 0.20 | A = 0+0.05 mm |
| 0.25 | A = 0+0.05 mm |
| 0.30 | A = 0+0.05 mm |
| 0.40 | A = 0+0.05 mm |
| 0.50 | A = 0+0.05 mm |
| 0.80 | A = 0+0.05 mm |
| Thick Film Ceramic Substrate | ||
| 14.TC Thick Film Substrate Properties | ||
| Item | Value | Unit |
| Maximum Dimension | 100*100 | mm |
| Line Spacing | ≥0.1 | mm |
| Line Width | As per customer product requirements | mm |
| Copper Peel Strength (Min.) | >8 | N/mm |
| Solderability | >95% | % |
| Delivery Form | Small panel delivery | - |
| Surface Condition | Bare copper / Solder mask / ENIG / IMS / Immersion Tin | μm |
| 15. Copper Pattern Spacing Dimension | ||
| Metal Layer Thickness(um) | Minimum Spacing (mm) | Minimum Pitch (mm) |
| 10 | 0.1 | 1 (Depends on the pattern) |
| 20 | 0.1 | 1 (Depends on the pattern) |
| 30 | 0.1 | 1 (Depends on the pattern) |
| 40 | 0.2 | 1 (Depends on the pattern) |
| 50 | 0.2 | 1 (Depends on the pattern) |
| 16. Copper Edge to Ceramic Edge | |
| Metal Layer Thickness(um) | Copper Edge to Ceramic Edge (mm) |
| 10 | A ≥ 0.15 |
| 20 | A ≥ 0.15 |
| 30 | A ≥ 0.15 |
| 40 | A ≥ 0.20 |
| 50 | A ≥ 0.20 |
