Ceramic PCB - Shenzhen Keyou Electronic Technology Co., Ltd.

Product Advantages

Advanced Ceramic Substrate Expertise for High-Power, High-Reliability Electronics.

Alumina, Aluminium Nitride, Silicon Nitride Ceramic AMB Copper Clad Circuit BoardsAlumina,

Aluminium Nitride, Silicon Nitride Ceramic surfaces, circuit boards

Alumina, Aluminium Nitride, Silicon Nitride Ceramic single or multi-layer circuit board fabrication

Product Application

Chip Aging

Advanced ceramic materials provide excellent thermal expansion matching with semiconductor chips, effectively reducing thermal stress and preventing damage caused by temperature fluctuations. This helps improve chip reliability, extend service life, and ensure stable long-term operation.

Precision Testing

Advanced testing technologies enable accurate performance evaluation of ceramic substrates and semiconductor components, effectively reducing thermal-related risks. Reliable testing processes ensure product stability, measurement accuracy, and consistent performance under demanding conditions.

Thermal Performance

High thermal conductivity ceramic substrates deliver outstanding heat dissipation performance, efficiently transferring heat away from electronic components. This improves thermal management efficiency, enhances device stability, and ensures reliable operation in high-power applications.

Automotive Applications

Ceramic substrate solutions provide excellent thermal management for automotive lighting and electronic systems. With superior heat resistance and reliability, they help improve product durability, maintain stable performance, and extend the service life of automotive components.

Technology

DPC Process

Step 1: Laser Drilling

Step 2: Magnetron Sputtering
Step 3: Assembly Line Production
Step 4: Electroplating
Step 5: Etching
Step 6: Solder Mask Coating
Step 7: Surface Treatment
Step 8: Forming
Step 9: Finished Product Inspection
Step 10: Packaging & Warehousing

DBC Process

Step 1: Copper Oxidation
Step 2: Lamination
Step 3: Sintering
Step 4: Assembly Line Production
Step 5: Etching
Step 6: Solder Mask Layer
Step 7: Surface Treatment
Step 8: Forming
Step 9: Finished Product Inspection
Step 10: Packaging & Warehousing

AMB Process

Step 1: Screen Printing Solder
Step 2: Lamination
Step 3: Sintering
Step 4: Assembly Line Production
Step 5: Etching
Step 6: Solder Mask Layer
Step 7: Surface Treatment
Step 8: Forming
Step 9: Finished Product Inspection
Step 10: Packaging & Warehousing

Thick Film Process

Step 1: Screen Printing Conductor
Step 2: Sintering
Step 3: Screen Printing Resistor
Step 4: Sintering
Step 5: Screen Printing Glass Glaze
Step 6: Sintering
Step 7: Laser Resistor Trimming
Step 8: Forming
Step 9: Finished Product Inspection
Step 10: Packaging & Warehousing

Basic Properties – Ceramics & Copper

1.Ceramic Types & Properties

Property	Al₂O₃	ALN	SIN	Unit
Density	3.7	3.3	3.2	g/cm³
Thermal conductivity	≥23	≥170	≥90	W/m·K
Thermal expansion	6.6~7.5 (25~500℃)	4.7 (20~300℃)	2.5 (20~300℃)	10⁻⁶/K
Bending Strength	≥330	≥350	700~800	MPa
Dielectric Loss	0.0003	0.0005	0.001	1MHz
Dielectric Constant	9	9	8	1MHz
Dielectric Strength	≥20	≥20	≥20	KV/mm
Electrical Resistivity	10¹⁴	10¹⁴	10¹⁴	Ω·cm

2.Copper Properties

Property	Parameter	Unit
Purity	≥99.99	%
O₂ content	OFHC	-
Hardness	80~110	HV
Electrical Conductivity	98.3	MS/m

3.General Properties & Tolerances

General Properties	Specification
Dimensional Tolerance	+0.2 / -0.05 mm
Master Substrate	138×190mm ±0.1mm / 130×130mm ±0.1mm
Copper Edge to Ceramic Edge	±0.15 mm
Total Thickness	±5%
Through-hole Diameter	±0.1 mm
Usable Area (for 130x130mm master)	127mm × 127mm
Usable Area (for 138x190mm master)	136mm × 187mm

Material Combination & Thickness

4. Ceramic Thickness vs Material

Tile Thickness (mm)	Al₂O₃	AlN	Si₃N₄
0.16	✓	✓	-
0.25	✓	✓	✓
0.32	✓	✓	✓
0.38	✓	✓	-
0.50	✓	✓	-
0.60	✓	✓	-
0.63	✓	✓	-
0.76	✓	✓	-
0.89	✓	✓	-
1.0	✓	✓	-
1.5	✓	✓	✓
2.0	✓	✓	✓

5. Ceramic Types & Thickness

Copper Sheet Thickness (mm)	Ceramic Thickness 0.25mm	Ceramic Thickness 0.32mm	Ceramic Thickness 0.38mm	Ceramic Thickness 0.635mm	Ceramic Thickness 1.0mm
0.15	SIN / Al₂O₃	SIN / Al₂O₃	Al₂O₃	SIN / AlN / Al₂O₃	SIN / AlN / Al₂O₃
0.20	SIN / Al₂O₃	SIN / Al₂O₃	Al₂O₃	SIN / AlN / Al₂O₃	SIN / AlN / Al₂O₃
0.25	SIN / Al₂O₃	SIN / Al₂O₃	Al₂O₃	SIN / AlN / Al₂O₃	SIN / AlN / Al₂O₃
0.30	SIN / Al₂O₃	SIN / Al₂O₃	Al₂O₃	SIN / AlN / Al₂O₃	SIN / AlN / Al₂O₃
0.40	SIN / Al₂O₃	SIN / Al₂O₃	-	SIN / AlN / Al₂O₃	SIN / AlN / Al₂O₃
0.50	SIN / Al₂O₃	SIN / Al₂O₃	-	SIN / AlN / Al₂O₃	SIN / AlN / Al₂O₃
0.80	SIN / Al₂O₃	SIN / Al₂O₃	-	SIN / Al₂O₃	SIN / AlN / Al₂O₃

Dimensional Tolerance and Surface Treatment

6.Dimensional Tolerances

Item	Dimensional Tolerance
Master Substrate	138x190mm ±0.1mm or 130x130mm ±0.1mm
Copper Edge to Ceramic Edge	±0.15mm
Total Thickness	±5%
Through-hole Diameter	±0.1mm

7. Usable Area

Master Size	Usable Area
130mm X 130mm Base Plate	127mm X 127mm
138mm X 190mm Base Plate	136mm X 187mm

8. Surface Finish

Surface Finish	Specification
Bare Copper	OSP
Anti-oxidation	OSP
Nickel plating	Ni: 2~10 μm
Au plating	Au: 0.1~0.20 μm
Ag plating	Ag: 0.3~1.0 μm
Sn plating	Sn: 0.1~0.2 mm

9. Corrosion Tolerance

Tolerance A	Thickness T
A ± 0.15 mm	T ≤ 0.20 mm
A ± 0.20 mm	T ≤ 0.25 mm
A ± 0.25 mm	T ≤ 0.40 mm
A ± 0.30 mm	T ≤ 0.50 mm
A ± 0.35 mm	T ≤ 0.80 mm

10.Solder Resist

Item	Parameter
Pattern Width	Min J > 0.3±0.2mm
Position Tolerance	±0.2mm
Minimum Space Between Solder Mask Patterns	≥0.3mm
Minimum Distance From Solder Mask Edge To Copper Edge	≥0mm (Copper Sheet Thickness≤0.3mm) / ≥1mm (Copper Sheet Thickness>0.3mm)
Heat Resistance	≤320℃/10s (Tested in accordance with IPC-TM-650, Method 2.6.8)

Design Specification for AMB Substrate

11. AMB Substrate Properties

Item	Value	Unit
Maximum Dimension	190*138	mm
Line Spacing	≥0.3	mm
Line Width	As per customer product requirements	mm
Copper Peel Strength (Min.)	>40	N/mm
Solderability	>95%	%
Delivery Form	Small panel delivery / Large panel delivery	-
Surface Condition	Bare copper / Solder mask / ENIG / Silver plating	μm

12. Copper Pattern Spacing Dimension

Copper Thickness (mm)	Minimum Spacing (mm)	Minimum Pitch (mm)
0.20	0.35	0.7
0.25	0.40	0.8
0.30	0.50	1.0
0.40	0.60	1.2
0.50	0.70	1.4
0.80	1.00	2.0

13.Copper Edge to Ceramic Edge

Copper Thickness(mm)	Copper Edge to Ceramic Edge
0.20	A = 0+0.05 mm
0.25	A = 0+0.05 mm
0.30	A = 0+0.05 mm
0.40	A = 0+0.05 mm
0.50	A = 0+0.05 mm
0.80	A = 0+0.05 mm

Design Specification for TC Thick Film Substrate

14.TC Thick Film Substrate Properties

Item	Value	Unit
Maximum Dimension	100*100	mm
Line Spacing	≥0.1	mm
Line Width	As per customer product requirements	mm
Copper Peel Strength (Min.)	>8	N/mm
Solderability	>95%	%
Delivery Form	Small panel delivery	-
Surface Condition	Bare copper / Solder mask / ENIG / IMS / Immersion Tin	μm

15. Copper Pattern Spacing Dimension

Metal Layer Thickness(um)	Minimum Spacing (mm)	Minimum Pitch (mm)
10	0.1	1 (Depends on the pattern)
20	0.1	1 (Depends on the pattern)
30	0.1	1 (Depends on the pattern)
40	0.2	1 (Depends on the pattern)
50	0.2	1 (Depends on the pattern)

16. Copper Edge to Ceramic Edge

Metal Layer Thickness(um)	Copper Edge to Ceramic Edge (mm)
10	A ≥ 0.15
20	A ≥ 0.15
30	A ≥ 0.15
40	A ≥ 0.20
50	A ≥ 0.20

Why Choose KEYOU?

Positioning

Focused on PCB prototypes and small-to-medium volume production with 22 consecutive years of manufacturing experience.
Advantages

Fast delivery, stable quality, and flexible production capabilities ensure reliable solutions for global customers worldwide.
Products

Supporting advanced PCB solutions including multilayer boards, HDI, rigid-flex circuits, and special application requirements.
Services

Providing customized services, technical support, and efficient communication throughout every project development process.

Customized Services

Ceramic-based circuit manufacturing is our core service scope, covering three major process systems: DPC, DBC and AMB, with comprehensive technical capabilities established.

We also introduce thick-film and thin-film processes to precisely meet the demands of special microelectronic products and enable the functional integration of circuit substrates.

See how it works

Contact Us

Quick quotation response, tailor-made circuit board solutions

Phone:

+86-13651431540

Email:

info@keyoupcb.com