Ultra-Thin PCB

0.1mm to 0.4mm thickness, functional and durable
• Precision Etching: Utilizes chemical or plasma etching methods to create intricate circuit patterns with high accuracy, essential for maintaining circuit integrity at reduced thicknesses.

•Advanced Lamination: Employs sophisticated lamination processes to stack and bond layers securely, ensuring structural stability and electrical reliability.

• Microvia Technology: Incorporates high density interconnect (HDI) technology with microvias for electrical connections between layers, enabling more complex circuits in smaller spaces.

• Material Selection: Involves using high quality, flexible materials that can withstand the stresses of thinning without compromising performance. Despite their minimal profile, this process ensures that the boards are functional and durable