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22L PCB for 5G Core Network
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22L PCB for 5G Core Network

T-Shaped Copper Coins Press-fit to Plated Cavities
• Doosan DS-7409DV Low Loss
• 2 lam cycles: L22-3 and L1-22
• 11 sets of backdrill plus VIP
• 20 T-Coins L22-3 and L3-1
• 10 sets of impedances SE/Diff
• HVLP Copper for improved SI
• Ormet Paste
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